Broke out test points, included recommended USB housing lands #7
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also rounded rectangle footprints, matched to RPi's recommended footprints
Might have also re-linked footprint from symbol
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I also updated pad dims to RPi's recommendations. USB housing lands are recommended to allow reflow when mounting as SMD, otherwise housing solder can keep it from sitting flush.
I included test points in both footprint and symbol. I also rearranged the pins a bit in the symbol to have +power pins on the top and GND pins on the bottom, with all digital gnd pins sharing a location and only one visible (TP gnd and AGND both visible and individually routable).
The major motivation here was breaking out access to the test points. I want my breakout board to have one button for both reset and bootsel. I was also considering adding a USB-C plug, which would be possible with the test points broken out.
I modeled the TPs as through-hole to allow for easier access for wicking or adding more solder post-mount. I'm not sure whether this or SMD pads would be better.